Stock Code :300410
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Pico Laser Cutting Machine JG32
Product Name: Pico Laser Cutting Machine 
Model Number: JG32
Certification: CE
Place of Origin: China
Packaging Details: Wooden Carton
  • Usage
  • Features
  • Parameters
  • Video

USAGE

 

The machine is used in cutting for CVL/FPC/RF and thin multilayer board, as well as cutting a variety of substrates,such as ceramic, silicon, aluminium foil, teflon etc.



Applications:

Focus on flexible PCB,cover layer,golden finger,ceramic,crystal cutting and drilling.



(1) Slight carbonization :

Carbonization is much weaker compared with nanosecond laser processing.

 

(2) Faster speed:

Processing speed increased several times compared with nanosecond processing.

 

(3)Cutting effect:

The processing surface is more smooth, neat, clean;

 

(4)More applications:

In addition to the traditional circuit board polymer and copper foil processing, picosecond can also process ceramics, silicon,Teflon and other materials.

 

(5)High intelligent :

Support EMCS, MES system. Automatically choose the cutting graphics unit by using identification of 2D bar code .


Specification of picosecond laser cutting machine

Applied Range

FPCCVLFPC, micro-connection, ceramics, silicon and so on

System Processing Accuracy

( ZHENGYE Conditions)

±20μm

 Laser power

15W@400kHz

 Laser Wavelength

355nm

Pulse Width

10ps

Frequency Range

4kHz-1MHz

Objects

Large processing size

550mmX650mm

Table number

Single beam, Dual platform

Dimensions (L×W×H)

 2200mm×2150mm×1750mm

Weight

3700kg

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