Pico Laser Cutting Machine JG32Product Name: Pico Laser Cutting Machine
Model Number: JG32
Place of Origin: China
Packaging Details: Wooden Carton
The machine is used in cutting for CVL/FPC/RF and thin multilayer board, as well as cutting a variety of substrates,such as ceramic, silicon, aluminium foil, teflon etc.
Focus on flexible PCB,cover layer,golden finger,ceramic,crystal cutting and drilling.
(1) Slight carbonization :
Carbonization is much weaker compared with nanosecond laser processing.
(2) Faster speed:
Processing speed increased several times compared with nanosecond processing.
The processing surface is more smooth, neat, clean;
In addition to the traditional circuit board polymer and copper foil processing, picosecond can also process ceramics, silicon,Teflon and other materials.
(5)High intelligent :
Support EMCS, MES system. Automatically choose the cutting graphics unit by using identification of 2D bar code .
Specification of picosecond laser cutting machine
FPC，CVL，FPC, micro-connection, ceramics, silicon and so on
System Processing Accuracy
( ZHENGYE Conditions)
Large processing size
Single beam, Dual platform