Stock Code :300410
info@zhengyee.com

Zhengye Technology Developed High Precision / High Efficiency Picosecond Laser Cutting Technology



FPC industry Gospel! Zhengye technology has developed high precision, high efficiency picosecond laser cutting technology, can be applied to the cover film (CVL) on a large scale, flexible board (FPC), soft and hard combination board (RF) and thin multi-layer board precision machining, promoted the industry's technology upgrades, cost reduction. 

R & D background 

Driven by consumer applications such as smartphones, smart cards and stacking packages, the demand for FPC thin materials is growing in recent years. And with the electronic products more and more towards the direction of precision, the market demand for high-precision processing is increasing, to promote a more accurate laser precision machining technology development. To meet the needs of the market, Zhengye technology researched and developed picosecond laser cutting machine, deep plowing electronic information industry in the field of intelligent manufacturing. picosecond laser cutting machine


Application areas

This equipment is suitable for cutting (CVL), flexible board (FPC), soft and hard bonded board (RF) and thin multilayer board cutting, as well as window and cover; can also be used to cut a variety of substrates, such as ceramics, Silicon, aluminum foil, Teflon, glass and so on.

Suitable for a variety of demanding fine precision, sensitive non-destructive, clean and smooth cutting requirements, to "cold processing" features, to solve the ceramic, silicon, glass, sapphire and other thin, crisp, hard materials, metal, polymer and other heat-sensitive materials and a variety of sticky, leather, tough materials, processing problems.

Technical advantages

With the market's existing nanosecond laser technology, picosecond laser technology with a variety of advanced technology advantages, it is the market trend.

1. processing speed is faster

Picosecond laser technology using 400kHz picosecond laser (1 ~ 1000kHz adjustable), galvanometer speed can be opened to 2000mm / s ~ 3200mm / s, much larger than the market on the nanosecond machine processing speed (1800mm / s), processing faster, more productive.

2. cutting quality is higher

With high efficiency and high quality picosecond lasers, the processing effect is better, cutting quality is better, higher yield, the soft board / cover film cutting the surrounding carbonation, charred phenomenon is more minor, to meet the needs of customers higher precision machining.

3. wider range of processing

Because picosecond laser technology has a higher peak power (up to 20MW), its cutting function is stronger, can be processed a wider range of materials, you can easily break through the nano-laser on ceramics, glass and other materials processing problems, and "collapse edge" effect is very good.

Zhengye technology picosecond laser technology unique advantages
1. carbonization slightly: laser pulse width is less than 10 picoseconds, carbonization range is very small, basically do not see the carbonization phenomenon.
2. Speed is faster: Picosecond repetition frequency is very high, up to megahertz, while galvanometer speed can be 3000mm / s speed, galvanometer speed to play. The speed can be increased by 1.5 times to nanosecond laser.
3. The cutting effect is more fine: Picosecond processing using a small single pulse energy, high-frequency processing, carved secret agents, the processing surface is more fine and smooth;
4. processing materials is wider: In addition to the traditional circuit board polymer materials and copper foil processing, picosecond can also be processed ceramics, silicon, Teflon and so on.

Sample display

Core technical parameters

project

specification

Laser source

Ultraviolet picosecond laser

wavelength

355nm

Pulse width

10ps

Frequency Range

1Hz2 MHz

Laser power

16W@400kHz

Single pulse energy

>200μJ

Laser frequency

400kHz1000 kHz

Galvanometer maximum scanning speed

3000mm/s

Maximum scan range

50mm×50mm

Focus spot

20±5µm

Maximum processing format

650mm × 550mm, single-head dual platform

Table XY axis movement maximum speed

800mm/s

Worktable XY axis positioning accuracy

±3μm

Worktable XY axis repeat positioning accuracy

±1μm

Precision

±20µm

Cutting material

FPC, CVL, FPC micro-connection, ceramics, silicon and so on

Cutting material thickness

0.012 mm to 1.0 mm

file format

* .gbr & * .dxf & * .lay